The Mediatek. Dimensity 7400X is a chipset designed specifically for flip-style foldable smartphones with dual-display support, launched on February 25, 2025. It builds on the foundation of the Dimensity 7400, offering nearly identical specifications but with optimizations for foldable devices. Below is a detailed breakdown of its full specifications based on available information:
General Specifications
Process Node: Built on TSMC’s 4nm process, ensuring power efficiency and performance.
Target Devices: Optimized for flip-style foldable smartphones with dual-display functionality.
Availability: Devices powered by the Dimensity 7400X are expected to hit the market in Q1 2025.
CPU
Architecture: Octa-core configuration.
Cores:
4x Arm Cortex-A78 performance cores clocked at up to 2.6 GHz.
4x Arm Cortex-A55 efficiency cores clocked at up to 2.0 GHz.
Performance: Offers a slight clock speed increase over its predecessor, the Dimensity 7300X, with improved efficiency due to the 4nm process.
GPU
Graphics: Arm Mali-G615 MC2.
Gaming Features: Supports MediaTek Advanced Gaming Technology (MAGT) 3.0, which enhances graphics performance, reduces input lag, and improves power efficiency during gaming.
Power Efficiency: Claims to use 14% to 36% less power during gaming compared to competing chipsets.
AI Processing
NPU: MediaTek NPU 6.0 (sometimes referred to as APU 655 in certain sources).
Performance Boost: Delivers a 15% improvement in AI performance over the Dimensity 7300X, enabling better on-device AI tasks like camera enhancements and gaming optimizations.
Memory and Storage
RAM Support:
LPDDR5 (up to 6400 Mbps).
LPDDR4X (backward compatibility).
Storage Support:
UFS 3.1.
UFS 2.2 (backward compatibility).
Display
Display Engine: MediaTek MiraVision 955.
Supported Resolutions and Refresh Rates:
WFHD+ (Wide Full HD+) at up to 120 Hz.
Full HD+ at up to 144 Hz.
Special Feature: Optimized for dual-display flip phones, providing flexibility for OEMs in foldable designs.
Camera
Image Signal Processor (ISP): MediaTek Imagiq 950 (12-bit HDR ISP).
Camera Support: Up to 200-megapixel sensors.
Features:
Motion Compensated Noise Reduction (MCNR).
Hardware Face Detection (HWFD).
Video HDR and Electronic Image Stabilization (EIS).
AI-driven autofocus and scene recognition.
Video Recording: Up to 4K HDR at 30 fps.
Additional Support: Google Ultra HDR for enhanced dynamic range and contrast in photos and videos.
Connectivity
5G Modem: Integrated 5G R16 modem.
Supports 3CC (3 Component Carrier) aggregation.
Peak downlink speed: Up to 3.27 Gbps (some sources mention 3.37 Gbps).
UltraSave 3.0+ technology for 20% lower power consumption compared to competitors.
Wi-Fi: Tri-band Wi-Fi 6E (2.4 GHz, 5 GHz, and 6 GHz) with 2T2R antenna configuration.
Bluetooth: Version 5.4.
Other: Enhanced connectivity for gaming with reduced latency (e.g., Wi-Fi HyperCoex technology).
Multimedia
Video Playback: Supports 4K resolution at 30 fps.
HDR: 12-bit HDR processing for superior image quality.
Power Efficiency
Gaming Efficiency: Reduces power consumption by 14% to 36% during gaming, depending on the workload, thanks to the 4nm process and UltraSave 3.0+ technologies.
AI Optimization: Adjusts game settings dynamically to balance performance and battery life.
Key Differences from Dimensity 7400
The Dimensity 7400X is specifically tailored for foldable devices with dual-screen support, while the Dimensity 7400 is designed for traditional smartphones. Other than this, their core specifications (CPU, GPU, ISP, etc.) are identical.
Additional Notes
The Dimensity 7400X retains much of the same architecture as its predecessor, the Dimensity 7300X, with incremental upgrades like a higher clock speed for the Cortex-A78 cores and the improved NPU 6.0.
It positions itself as a mid-range chipset with premium features, targeting affordable foldable devices with strong gaming, AI, and camera capabilities.
This chipset is part of MediaTek’s strategy to bring advanced features to mid-range and foldable smartphones, competing with the likes of Qualcomm’s Snapdragon 7 series. Devices with the Dimensity 7400X should start appearing in early 2025, offering a blend of performance and efficiency for the growing foldable market.