Technology

MediaTek Dimensity 8350 Full Specifications

Admin March 26, 2025

General Information

CPU (Central Processing Unit)

Architecture: Armv9-A
Core Configuration: Octa-core (8 cores) in two clusters:
- 1x Cortex-A715 Prime Core: Up to 3.35 GHz
- 3x Cortex-A715 Performance Cores: Up to 3.2 GHz
- 4x Cortex-A510 Efficiency Cores: Up to 2.2 GHz
Instruction Set: 64-bit

GPU (Graphics Processing Unit)

Model: ARM Mali-G615 MC6 (Multi-Core, 6 cores)
Features:
- Supports displays up to WQHD+ (2960 x 1440) at 120 Hz or Full HD+ at 180 Hz
- Enhanced by MediaTek StarSpeed Engine for gaming:
  - 10% reduced power consumption
  - 24% faster scene transitions
  - Improved frame rate consistency (low jitter)
Gaming Performance: 60–120 FPS in popular titles like PUBG and Genshin Impact (varies by device optimization)

Memory and Storage

RAM Support: Quad-channel LPDDR5X
- Max Frequency: 8533 Mbps
- Max Capacity: Up to 24 GB
Storage Support: UFS 4.0 (Ultra-Fast Storage)

AI Capabilities

NPU (Neural Processing Unit): MediaTek NPU 780
Performance: Supports generative AI tasks and large language models (LLMs) with up to 10 billion parameters
Features: Enhanced AI photography, voice recognition, and app performance

Connectivity

5G Modem: Integrated 5G modem
- Downlink Speed: Up to 5.17 Gbps
- Features:
  - Supports Sub-6GHz and mmWave
  - Advanced carrier aggregation
  - MediaTek 5G UltraSave 3.0+ for power efficiency
Wi-Fi: Wi-Fi 6E (2T2R antenna)
- MediaTek Wi-Fi/Bluetooth hybrid coexistence for low latency
Bluetooth: Version 5.4
- Supports Bluetooth LE Audio with Dual-Link True Wireless Stereo Audio
Navigation: GNSS support (GPS, GLONASS, Galileo, BeiDou, etc.)

Camera Support

ISP (Image Signal Processor): MediaTek Imagiq 980 (14-bit HDR)
Max Camera Resolution:
- Single camera: Up to 320 MP
- Triple camera: Up to 32 MP + 32 MP + 32 MP
Video Recording: Up to 4K at 60 FPS
Features:
- Video HDR, Bokeh, EIS (Electronic Image Stabilization)
- Video Noise Reduction (NR)
- AI-enhanced color capture

Display Support

Power and Efficiency

TDP (Thermal Design Power): Approximately 10W (varies by workload)
Efficiency Features:
- 4nm process for better power efficiency
- StarSpeed Engine for optimized gaming power consumption

Additional Features

Customizability: Dimensity 5G Open Resource Architecture (allows device makers to customize camera, NPU, display, and connectivity)
First Devices: OPPO Reno 13 series (launched November 25, 2024)

Benchmark Scores (Approximate, based on early tests with OPPO Reno 13 Pro)

Notes

The Dimensity 8350 is a minor upgrade over the Dimensity 8300, with key improvements in gaming performance (via the StarSpeed Engine) and slight efficiency gains, while retaining the same core CPU and GPU architecture.
Performance may vary depending on the device’s cooling, software optimization, and workload.